400G QSFP-DD or OSFP DAC for intra-rack 400G in AI cluster and high-density spine-leaf. Straight-through, 2× 200G, 4× 100G, or 8× 50G fanout — same product line, different topology.
Form factors valid for 400G
Straight-through, breakout, or custom RFQ
Breakouts split a single Side A connector into multiple Side B legs. Custom (RFQ) routes the configuration to engineering for review.
Passive vs Active selection (passive default for short links).
Defaults to Passive. Active is recommended for longer runs. Custom routes to engineering review.
Mirrors Side A in straight-through; thermal top is independent
Side B mirrors Side A in straight-through. Choose a breakout architecture above to split into independent legs.
Standard lengths in meters; custom triggers engineering review
Custom lengths trigger engineering review.
Both ends share coding in straight-through
Vendor coding ensures the part number routes correctly. "Custom" triggers engineering review.
This configuration requires engineering review
Submitting will route to our engineering team for confirmation.
